IC substrates are a basic component of IC packages, which, combined with other electronic components in an assembly, control functions of an electronic appliance. IC packages can be broadly divided into single chip modules (or SCMs) and multi-chip modules (or MCMs), with the former containing one IC chip, and the latter containing multiple chips and other electronic devices. Meadville produce SCM substrates, including CSPs, BOCs and PBGAs (concentrating on the ultra-thin CSP and BOC market) and MCMs in "stacked die" and "chip array" formats.

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