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Conventional
PCB Roadmap
Back| Technology Roadmap for Conventional PCB | ||||
| Item |
2008
|
2009
|
2010
|
|
| Max Layer Count |
48
|
52
|
56
|
|
| Max Production Panel Size |
24.5''x43''
|
24.5''
x 43''
|
24.5''
x 43''
|
|
| Border Thickness |
Min
|
0.18mm
|
0.18mm
|
0.18mm
|
|
Max
|
8.0mm
|
10.0mm
|
10.0mm
|
|
| Min Core Dielectric Thickness |
50um
|
38um
|
25um
|
|
| Max Aspect Ratio |
13
|
15
|
16
|
|
| Min Drill Size |
8mil
|
6mil
|
6mil
|
|
| Min Line Width/Spacing |
Inner Layer
|
3.0/3.0mil
|
2.0/3.0mil
|
2.0/2.0mil
|
|
Outer Layer
|
3.0/3.5mil
|
3.0/3.0mil
|
3.0/3.0mil
|
|
| Back Drilling Tolerance |
+/-5mil
|
+/-4mil
|
+/-3mil
|
|
| Impedance Control Tolerance |
>=50ohm
|
+/-8%
|
+/-7%
|
+/-5%
|
|
<50ohm
|
+/- 4 ohm
|
+/- 4 ohm
|
+/- 3 ohm
|
|
| Press Fit Hole Tolerance |
+/-2mil
|
+2/-1mil
|
+2/-1mil
|
|
| Via in Pad |
Yes
|
Yes
|
Yes
|
|
| Heavy Copper |
5oz
|
5oz
|
5oz
|
|
| Surface Finishing |
ENIG, OSP,
ENIG+OSP |
Yes
|
||
| Immersion Tin |
Yes
|
|||
| Immersion Silver |
Yes
|
|||
| HASL |
Yes
|
|||
| Electrolytic Gold |
Gold Finger, Selective hard gold,
Soft Gold, Flash Gold
|
|||
| Material |
Normal Tg
|
SYL S1141, Mica-AVA EG-150T
|
||
|
Middle Tg
|
SYL S1141KF, SYL S1000,Mica LA-01, Mica LA-02 | |||
|
High Tg
|
SYL S1170, Mica-AVA HR-01,
Mica-AVA HR-02, Hitachi MCL-E-679, Hitachi MCL-E-679F(J), Isloa FR406, Isloa IS410, Isola FR-370HR Nelco N4000-6, Nelco N4000-11 |
|||
|
Halogen Free
|
SYL S1155, Hitachi MCL-BE-67G(H), Panasonic R-1566W | |||
|
Low Dk
|
Isola FR408, Isola IS620, Getek ML200, Megtron R5715, Nelco N4000-13, 13SI & New EP Series | |||
|
Thermal-Superior
|
Nelco N5000(BT), Arlon 33N(Polyimide) | |||
|
Low Loss
|
FR4: Rogers RO4003, RO4350,RO4450,
Arlon 25FR Tlefon: Taconic RF35/TLC/TLX/TLY/TLG, Rogers RO3003, Arlon AD Series, AR1000 |
|||
| Advanced |
Buried
Resistor
|
Ohmega-Ply
|
||
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