Print + Etch
Inner Layers |
Internal layer circuit patterns are formed by UV lithography and etching. |
| AOI |
The quality of etched patterns is verified by Automated Optical Inspection. |
Multilayer
Lamination |
A multilayer board is formed by laminating etched inner layers, prepreg and copper foil. |
Via Hole
Formation |
Via holes to electrically connect various layers are formed by drilling and copper plating. |
Primary
Image |
A negative pattern conductor image(plating mask) is formed by UV lithography. |
Pattern
Plating |
The external conductor pattern is plated with copper and tin to form a positive image. |
Pattern
Etch |
The external conductor pattern is formed by stripping the mask and etching the pattern. |
| AOI |
The quality of etched quality patterns is verified by Automated Optical Inspection. |
Soldermask
Coating |
Soldermask is screen coated and a pattern is formed by UV lithography, then cured. |
Panel
Routing |
Parts are machined to finished size. Mechanical features (slots, scores) may be added. |
Surface
Finishing |
Component pads are coated with metallic or organic solderable preservatives. |
| FQC |
Finished parts are electrically tested and visually inspected to verify quality, then packaged. |
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